C11 Part Number System for Thermal T ransfer Labels: Non-Laminated Labels. C10 Thermal T rans fer La bels: Self- Lamina ting Lab els. C9 Part Number System for Thermal T ranfser Labels: Self-Laminating Labels. C7 Laser/Ink Jet Labels:įiber Optic Cable Identification System and Laser/Ink Jet Self-Laminating Labels. C6 Laser /Ink Je t Labels : Compo nent Lab els. C5 Part Num ber Sys tem for La ser/In k Jet Label s: Compo nent Lab els. C5 Laser/Ink Jet Labels: Flag Style Labels. C4 Laser/Ink Jet Labels: Non-Laminated Labels. C3 Part Number System for L aser/Ink Jet Labels: Non-Laminated Labels. C2 Laser /Ink Je t Labels : Self-L aminat ing Lab els. Part Number Sys tem for Laser/Ink Jet Labels: Self-Laminating Labels. B18 Component Labeling: Network Identification Labels Selection Guide b y Size. B16-B17 Part Number System for C omponent Labels: Network Systems Identification Labels. B15 Component Labeling: General Component Lab els Selection Guide b y Size. B14 Part Num ber Sys tem for Co mpone nt Label ing: Gener al Compo nent Lab els. B13 Component Labeling: Electronic Component an d Circuit Board Labels Selection Guide by Size. B12 Part Number System for C omponent Labels: Electronic Component and Circ uit Board Labels. B11 Component Labeling: T erminal Block Labels Selection Guid e by Strip Size. B10 Part Number System for T erminal Block Labeling: T erminal Block Labels. B9 Wire/Cable Labeling: Heat Shrink Wire/Cab le Labels Selection Guide by Wire Size. B8 Part Num ber Sys tem for Wire/C able La beling : Heat Sh rink Lab els. B7 Wire/Cable Labeling: Flag Style Labels Selection Guide b y Wire/Cable S ize. B6 Part Number System for Wire/Cable Labeling: Flag Style Labels. B5 Wire/Cable Labeling: Non-Laminated Labels Selection Gu ide by Wire/Cab le Size. B3-B4 Part Number System for Wire/Cable Labeling: Non-Laminated Labels. B2 Wire/Cable Labeling: Self-Laminating Labels Selection Guide b y Wire/Cable S ize. Part Num ber Sys tem for Wire/C able La belin g: Self- Lamin ating Lab els.
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